ODVA FEATURES BENEFITS OF ETHERNET/IP FOR MANUFACTURERS AT PACK EXPO IN SEPTEMBER

Ethernet/IP and CIP (Common Industrial Protocol) are going to get a showcase this September in Las Vegas. ODVA announced today that it has accepted an invitation by PMMI, the leading global trade association for packaging and processing technologies, to join the Association Pavilion at Pack Expo Las Vegas on September 23-25, 2013.  Each year, Pack Expo is visited by over 25,000 attendees who view state-of-the-art materials, machinery and methods for packaging and processing from over 1,500 companies. Pack Expo is considered a must-see for anyone working with packaging and packaging design.

ODVA’s attendance at the show will provide a critical touchpoint for end users and OEMs who are seeking to learn the benefits about the use of EtherNet/IP and the Common Industrial Protocol (CIP) in their packaging applications.  

“With integrated functional safety, distributed motion, and energy management, all on standard, unmodified Internet and Ethernet technologies, EtherNet/IP has been the network of choice for many users in the packaging industry,” said Katherine Voss, president and executive director, ODVA. “ODVA is proud to accept the invitation to participate in this important show in order to assist end users and OEMs with questions they have on how to best apply EtherNet/IP to solve their application needs.”

ODVA will be located at Booth C-343 in the Association Pavilion in the Central Exhibit Hall.  For more information about its exhibit, visit www.odva.org or contactodva@odva.org.

 

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