Siemens' Siplus Extreme ET200SP Distributed I/O System

Aug. 26, 2013
The I/O requires approximately 50% less space than conventional I/O modules

Siplus Extreme ET200SP distributed I/O system combines easy-to-use features with high efficiency even in harsh environments. The I/O requires approximately 50% less space than conventional I/O modules, and operates from -40 °C to +70 °C. It’s resistant to harmful gases, is protected against condensation, and operates at elevations from -1000 m to +5000 m.

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