Siemens' Siplus Extreme ET200SP Distributed I/O System

The I/O requires approximately 50% less space than conventional I/O modules
Aug. 26, 2013

Siplus Extreme ET200SP distributed I/O system combines easy-to-use features with high efficiency even in harsh environments. The I/O requires approximately 50% less space than conventional I/O modules, and operates from -40 °C to +70 °C. It’s resistant to harmful gases, is protected against condensation, and operates at elevations from -1000 m to +5000 m.

Learn more.

Request More Information

By clicking above, I agree to Endeavor Business Media's Terms of Service and consent to receive promotional communications from Endeavor, its affiliates, and partners per its Privacy Notice. I also understand my personal information will be shared with the sponsor of this content, who may contact me about their offerings per their privacy policy. I can unsubscribe anytime.