In Europe for the first time, ODVA held its 2023 industry conference and 22nd annual members meeting on Oct. 17-19 in El Vendrell, Spain, near Barcelona. More than 125 industry professionals from approximately 50 worldwide companies attended, and learned about single-pair Ethernet (SPE), 5G, cybersecurity, process automation, time-sensitive networking (TSN) and data science.
The event featured two keynote addresses. The first, by Vincenzo Renda, associate director for digital transformation policy at DigitalEurope, discussed the future of data management. He showed manufacturers how stay ahead of the latest rules affecting the data they generate and let others access, especially in Europe. The second keynote, by Keith Larson, VP and group publisher at Endeavor Business Media, presented the results of a survey that ODVA commissioned on the future of single-pair Ethernet (SPE) that showed strong market opportunities and the need for industry-wide education.
In addition, the conference included updates by ODVA’s leadership on recent accomplishments, such as launching of Ethernet-Advanced Physical Layer (APL), collaborations across process automation, security and energy management, and the availability of process device profiles, as well as future initiatives for ODVA that will accelerate progress on enhancing EtherNet/IP. ODVA continuously enhances the EtherNet/IP protocol to meet users’ needs for safety, security and interoperability, along with anticipating future opportunities such as Industry 4.0, IIoT and data science.
Other highlights of ODVA’s event included a process automation interchangeability demonstration highlighting the workflow and user experience between multiple devices being enabled by process device profiles. Likewise, technical sessions on the latest developments in ODVA’s Common Industrial Protocol (CIP) technologies and applications included:
• Industrial Ethernet Security Harmonization Group (IESHG) on collaboration by Endress+Hauser;
• Constrained CIP Security best practices by Rockwell Automation;
• Automatic CIP Security via pull policy by HMS Networks, Schneider Electric and Rockwell Automation;
• The future of 5G on the factory floor by HMS Networks;
• Process device profiles come to life by Emerson, Endress+Hauser, Honeywell, Krohne, Phoenix Contact and Rockwell Automation;
• Expanding constrained EtherNet/IP to on-machine sensors by Rockwell Automation;
• Evaluating EtherNet/IP and CIP Safety communication via 5G by Omron;
• General-purpose SPE for process instruments by Endress+Hauser and Rockwell Automation;
• High-availability, process-safety applications enabled by concurrent connections by Rockwell Automation;
• What a central network controller for industrial automation means for ODVA by Cisco;
• The other five wires in the in-cabinet SPE solution by Rockwell Automation;
• IT and OT collaboration on cybersecurity in industrial control by Cisco;
• Evolving the CIP Energy objects by Schneider Electric;
• Leveraging 5G networks and EtherNet/IP to enable TSN, clustered networks and deterministic connectivity for sensor-to-cloud architectures by Utthunga;
• Industrial automation wireless networks update for CIP communications by Cisco, Rockwell Automation and Panduit;
• Reducing obstacles for interoperability test participation via suggested updates to the recommended functionality for EtherNet/IP devices document by HMS Networks;
• Enabling data scientist use cases with discoverability and metadata by Rockwell Automation; and
• Latest developments in conformance testing by ODVA
A new ODVA membership video also debuted during the annual meeting. Finally, a new process automation technology paper and video were announced, which emphasize all of EtherNet/IP’s recent adaptations to the process industries.
For more information or to download the technical papers and presentations from ODVA’s conference, click here.