From November 18–20 at McCormick Place in Chicago, Automation Fair 2025 attendees will experience firsthand how integrated engineering and manufacturing workflows are transforming the future of automation in Booth #1519.
Three innovations, one unified vision
Not only is this year’s showcase centered around our customers, we’re also debuting three new solutions designed to streamline design, accelerate production, and support scalable deployments:
- RiLineX Power Platform: A modular busbar power distribution system that delivers up to 30% engineering time savings and 75% faster assembly. Visitors can test its tool-free click-assembly design in the interactive “RiLineX Buzzer Challenge,” a hands-on competition with prizes.
- Eplan Platform 2026: Featuring a dynamic Digital Twin workflow, this platform uses a Hypervision Hologram to present a 3D control cabinet in motion. It demonstrates how engineering data drives automated fabrication and wiring, enabling verification and downstream planning.
- VX Hybrid Double Door: Rittal’s new enclosure system combines durability with mobility, ideal for field deployment and streamlined maintenance. It’s available to order and expected to launch shortly after the fair.
Powering Progress Through Partnership
Rittal and Eplan’s collaboration with Microsoft and Rockwell Automation highlights the power of centralized data and connected systems. Their joint Liquid Processing System (LPS) demo showcases how integrated engineering and manufacturing can drive efficiency and innovation.
Additional partner highlights include:
- Studio 5000 Logix Designer V38: Enhanced integration with Eplan supports consistent workflows between electrical and software engineering.
- Emulate3D: Transfers wiring and I/O data directly from Eplan schematics to digital twins, saving time and improving accuracy.
- GEA kytero2000: A pharma separator built on a complete Eplan project, leveraging Rockwell device data for seamless design and deployment.
- Brady Wraptor & Data Automation: A new connector between Eplan and Brady enables automated label creation, printing, and application in a single wire workflow.
- Purdue Capstone Project: A joint engineering initiative with Purdue University, Rockwell Automation, Rittal and Eplan, showcasing the next generation of automation talent.
Experience the future, in the Discovery Theater and on the show floor
In addition to our Elite showcase, experts from Rittal and Eplan will be providing educational content in the form of three micro-sessions and one technical session. You can find the sessions schedule online and on the app. The rest of our team will be at your disposal in Booth #1519 for personalized consultations. Attendees can reserve time to discuss projects and explore how these solutions can be tailored to their specific needs.